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Glass Passivated Die Construction High Case Dielectric Strength of 1500VRMS Low Reverse Leakage Current Surge Overload Rating to 200A Peak Ideal for Printed Circuit Board Applications
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Glass Passivated Die Construction High Case Dielectric Strength of 1500VRMS Low Reverse Leakage Current Surge Overload Rating to 200A Peak Ideal for Printed Circuit Board Applications