Description

Product details

• Power pack • Low power loss, high efficiency • Low forward voltage drop • High forward surge capability • High frequency operation • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder bath temperature 275 °C maximum, 10 s, per JESD 22-B106 (for TO-220AC and ITO-220AC package)

Keywords

• JESD
• 245 °C
• MBR1045
• MSL level
• J-STD-020
• Power pack
• Low power loss
• LF maximum peak
• high efficiency
• TO-263AB package
• ITO-220AC package
• Low forward voltage drop
• High frequency operation
• Solder bath temperature 275
• High forward surge capability